GEEKOM Mini A9 MAX – AMD Ryzen AI 9 HX 470 | 32GB DDR5 (Dual-Channel) | 1TB SSD | Wi-Fi 7 BT 5.4 | Windows11 PRO – 3Y

• Ryzen™ AI 9 Power with Radeon™ 890M Graphics: AMD Ryzen™ AI 9 HX 470 and HX 370 combine Zen 5 CPU cores, an XDNA™ 2 NPU and Radeon™ 890M graphics. The platform delivers up to 86 Platform TOPS for compatible Copilot+ PC experiences, AI-assisted creation, coding, media work, development and optimized 1080p gaming.
• Built for Continuous Work: IceBlast 3.0 combines a large fan, all-copper cooling module, three copper heat pipes and dedicated copper cooling for CPU power circuitry to support power profiles up to 54W. A compact metal chassis, selected SSDs and key components, plus 339 reliability tests, EMC and ESD testing, stable USB power and repeated plug-in testing help support dependable day-and-night operation.
• 32GB + 2TB Ready, with Room to Grow: Selected models arrive with 32GB of DDR5 memory and a 2TB PCIe 4.0 SSD. Dual SO-DIMM and dual M.2 slots support up to 256GB of DDR5 memory and 8TB of total storage for large media libraries, virtual machines, datasets and future upgrades.
• Four Displays and Dual 2.5GbE for Bigger Workflows: Dual 40Gbps USB4 ports and dual HDMI 2.1 outputs support up to four 4K displays for code, financial dashboards, content creation and multi-window productivity. Dual 2.5GbE, Wi-Fi 7, Bluetooth® 5.4 and an SD Card 4.0 reader provide fast, flexible access to networks, storage and peripherals.
• Local AI Assistance, Cloud AI When You Need More: The XDNA™ 2 NPU supports compatible local AI-assisted tools and smaller quantized models, helping keep suitable work on-device. For larger models, deeper reasoning and broader knowledge tasks, use cloud AI services alongside your local workflow.
• Ready for Your Preferred Setup: Windows 11 Pro comes pre-installed, with Linux compatibility for development, virtualization, content creation and flexible deployment.

Engineered Precisely. Finished Beautifully. Precisely Built. Beautifully Finished.

Unyielding Full-Metal Shell

Engineered with a reinforced full-metal chassis that endures up to 200 kg of pressure without bending safeguarding internal components with unwaving strength and long-lasting resilience.

The Next AI Flagship, Redefined

Now powered by Ryzen™ AI 9 HX 470 for next-generation on-device AI performance

Pro-Grade Cooling Designed for Sustained Performance

The A9 Max’s IceBlast 3.0 thermal system features a large copper heatsink, dual heat pipes, a quiet high- performance fan, and premium thermal compounds. Its spacious layout and efficient side intake/rear exhaust airflow prevent overheating and throttling, ensuring stable performance during heavy or prolonged use.

Specifications